System Integration & Reliability Testing

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From prototype to field-ready — we deliver fully validated hardware that meets performance targets and clears all qualification gates.

Modern power electronic systems don’t exist in isolation — they must interface with complex environments, survive harsh conditions, and meet regulatory standards across thermal, mechanical, electrical, and EMC domains.

At MarSum Solutions, system integration and reliability validation are critical to our delivery model. We ensure your design works not only in simulation and lab conditions — but across varied use cases, real-world loads, and environmental extremes.

We build integration plans, execute reliability test campaigns, and support compliance documentation across industrial, automotive, aerospace, and HVAC/R sectors.

We ensure that all subsystems — power, control, comms, safety, mechanical, and thermal — operate together under real-world load and failure scenarios.

Integration Activities Include:

• Power stage + controller firmware bring-up
• Communication interface validation: CAN 2.0 / CAN-FD, RS‑485/Modbus, 10BASE‑T1, EtherCAT
• Motor/load interface tuning (drives, compressors, pumps, etc.)
• Safety logic cross-verification (overtemp, overcurrent, watchdogs, fault flags)
• Sensor calibration and feedback-loop closure — guarantees <0.2% gain error prior to closed-loop tuning
• Embedded + PC tool communication sync (diagnostics, logging, telemetry)
• Connector pinout validation and cable/harness integrity
• EMI-sensitive subsystem interaction and fault-injection testing
• Holistic fault-tree validation: open sensor, inverter fault, reset recovery
  

All integration is verified through:

• Staged operation scenarios and regression testing
• High-speed scope capture and analog signal logging
• Pre-FMEA validation tracebacks

We combine modeling, environmental exposure, and long-cycle stress tests to verify lifetime margin and failure tolerance.

Test Modalities:

• Thermal cycling (–40 °C ↔ 125 °C, 15 min ramps) — >500 h powered endurance with no solder-joint fractures
• Thermal shock per IEC 60068‑2‑14 (Nb, rapid air-to-air transitions)
• Humidity soak and condensation exposure — per IEC 60068‑2‑78 / ‑2‑30 cyclic profiles
• Vibration and shock: SAE J1455, ISO 16750‑3, MIL‑STD‑810H (random and sine)
• UV aging, salt spray, corrosion resistance (ASTM B117)
• Power cycling, flexure, and drop/impact simulation
• Combined HALT/HASS-style test campaigns (thermal + vibration + load)
   

We analyze failure signatures using:

• Thermal imaging and datalogging under stress
• X-ray and visual inspection of interconnect failures
• Sherlock® physics-of-failure modeling for long-term extrapolation

We align designs with global standards — from emissions compliance to safety-critical behavior.

EMI/EMC Compliance:

• CISPR 25 (vehicle), CISPR 32 (ITE), CISPR 11 Group 1 Class A (industrial)
• EN 61800-3, EN 61000-6-x, FCC Part 15 Class A/B, ISO 7637-2
• BCI per ISO 11452‑4, EFT per IEC 61000‑4‑4, surge/ESD testing
• Grounding and shielding strategy validation
• Pre-compliance scans with tuning recommendations
  

Safety & Functional Standards

• ISO 26262 functional safety (ASIL B–D designs)
• IEC/UL 60730‑1 Annex H (Class B firmware protection), IEC 60335
• IPC-A-610, IPC-2221, and IPC-9592B for power-conversion reliability
• Creepage/clearance verification and PE continuity checks
• Inrush, isolation, and short-circuit path validation
  

Documentation Support

• Validation plans for EVT, DVT, PVT phases and PPAP-level qualification
• Compliance matrices for agency submission
• Failure reporting and CAPA tracking
• DVP&R support and final sign-off planning
• Lab coordination for certification and retesting

We maintain a complete integration lab environment to support power-electronic validation.

Available Tools and Rigs:

• Real-time logging: CAN sniffers, UART/SPI debuggers, analog capture
• Waveform diagnostics with scope + current/voltage probes
• Programmable environmental chambers (–40 °C – +180 °C, 5%–95% RH)
• Thermal imagers and point-sensor loggers
• Vibration and shock test rigs (10 g RMS, 8 h/axis)
• Custom HIL and SIL systems (motor emulators, loopback setups)
• EMI/EMC test interfaces: LISNs, EMI receivers, BCI injectors
   

Custom Test Systems Include:

• Control-loop stress test setups for edge-case conditions
• Load profiling emulators for dynamic drives
• Mixed-domain test stands for power + motion + thermal